IC-628-SGG - Samtec Inc.

Part Number	IC-628-SGG
Part Status	Active
Type	DIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)	28 (2 x 14)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30µin (0.76µm)
Contact Material - Post	Phosphor Bronze
Housing Material	Polyester, Glass Filled
Operating Temperature	-55°C ~ 125°C
Weight	-
Country of Origin	-

Image	Part Number	Manufacturers	Description	View
	IC-628-SGG	Samtec Inc.	CONN IC DIP SOCKET 28POS GOLD	Details
	IC-628-SGT	Samtec Inc.	CONN IC DIP SOCKET 28POS GOLD	Details