XR2C-2000-HSG - Omron Electronics Inc-EMC Div

Part Number	XR2C-2000-HSG
Part Status	Active
Type	Housing
Number of Positions or Pins (Grid)	20 (1 x 20)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	-
Contact Finish Thickness - Mating	-
Contact Material - Mating	Beryllium Copper
Mounting Type	-
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	-
Contact Finish Thickness - Post	-
Contact Material - Post	Beryllium Copper
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-55°C ~ 125°C
Weight	-
Country of Origin	-

Part Number	Manufacturers	Description	View
XR2C-0311-N	Omron Electronics Inc-EMC Div	CONN SOCKET SIP 3POS GOLD	Details
XR2C-1501-N	Omron Electronics Inc-EMC Div	CONN SOCKET SIP 15POS GOLD	Details
XR2C-1511-N	Omron Electronics Inc-EMC Div	CONN SOCKET SIP 15POS GOLD	Details
XR2C-1611-N	Omron Electronics Inc-EMC Div	CONN SOCKET SIP 16POS GOLD	Details
XR2C-2000-HSG	Omron Electronics Inc-EMC Div	CONN IC SOCKET 20POS	Details
XR2C-2002	Omron Electronics Inc-EMC Div	CONN SOCKET SIP 20POS GOLD	Details
XR2C-2005	Omron Electronics Inc-EMC Div	CONN SOCKET SIP 20POS GOLD	Details
XR2C-2011-N	Omron Electronics Inc-EMC Div	CONN SOCKET SIP 20POS GOLD	Details
XR2C-2015	Omron Electronics Inc-EMC Div	CONN SOCKET SIP 20POS GOLD	Details
XR2C-3200-HSG	Omron Electronics Inc-EMC Div	CONN IC SOCKET 32POS	Details