XR2C-2005 - Omron Electronics Inc-EMC Div

Part Number	XR2C-2005
Part Status	Active
Type	SIP
Number of Positions or Pins (Grid)	20 (1 x 20)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	30µin (0.76µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	30µin (0.76µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature	-55°C ~ 125°C
Weight	-
Country of Origin	-

Part Number	Manufacturers	Description	View
XR2008IMP8	Exar Corporation	IC AMP R-R 0.5MA 75MHZ DL 8MSOP	Details
XR2008IMP8MTR	Exar Corporation	IC AMP R-R 0.5MA 75MHZ DL 8MSOP	Details
XR2008IMP8X	Exar Corporation	IC AMP R-R 0.5MA 75MHZ DL 8MSOP	Details
XR2008ISO8	Exar Corporation	IC AMP R-R 0.5MA 75MHZ DL 8SOIC	Details
XR2008ISO8MTR	Exar Corporation	IC AMP R-R 0.5MA 75MHZ DL 8SOIC	Details
XR2008ISO8X	Exar Corporation	IC AMP R-R 0.5MA 75MHZ DL 8SOIC	Details
XR2009IMP8	Exar Corporation	IC AMP R-R 0.2MA 35MHZ DL 8MSOP	Details
XR2009IMP8MTR	Exar Corporation	IC AMP R-R 0.2MA 35MHZ DL 8MSOP	Details
XR2009IMP8X	Exar Corporation	IC AMP R-R 0.2MA 35MHZ DL 8MSOP	Details
XR2009ISO8	Exar Corporation	IC AMP R-R 0.2MA 35MHZ DL 8SOIC	Details