44-547-11E Detailed Description
Part Number |
44-547-11E |
Part Status |
Active |
Type |
SOIC, ZIF (ZIP) |
Number of Positions or Pins (Grid) |
44 (2 x 22) |
Pitch - Mating |
- |
Contact Finish - Mating |
Gold |
Contact Finish Thickness - Mating |
20µin (0.51µm) |
Contact Material - Mating |
Beryllium Copper |
Mounting Type |
Through Hole |
Features |
Closed Frame |
Termination |
Solder |
Pitch - Post |
0.050" (1.27mm) |
Contact Finish - Post |
Gold |
Contact Finish Thickness - Post |
20µin (0.51µm) |
Contact Material - Post |
Beryllium Copper |
Housing Material |
Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature |
- |
Weight |
- |
Country of Origin |
- |
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