210-2599-00-0602 Detailed Description
| Part Number |
210-2599-00-0602 |
| Part Status |
Active |
| Type |
SIP, ZIF (ZIP) |
| Number of Positions or Pins (Grid) |
10 (1 x 10) |
| Pitch - Mating |
0.100" (2.54mm) |
| Contact Finish - Mating |
Gold |
| Contact Finish Thickness - Mating |
30µin (0.76µm) |
| Contact Material - Mating |
Beryllium Copper |
| Mounting Type |
Through Hole |
| Features |
- |
| Termination |
Solder |
| Pitch - Post |
0.100" (2.54mm) |
| Contact Finish - Post |
Gold |
| Contact Finish Thickness - Post |
30µin (0.76µm) |
| Contact Material - Post |
Beryllium Copper |
| Housing Material |
Polysulfone (PSU), Glass Filled |
| Operating Temperature |
-55°C ~ 125°C |
| Weight |
- |
| Country of Origin |
- |
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