| Part Number | 808-AG11D-LF |
|---|---|
| Part Status | Active |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 25.0µin (0.63µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 25.0µin (0.63µm) |
| Contact Material - Post | Copper |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
| Operating Temperature | -55°C ~ 105°C |
| Weight | - |
| Country of Origin | - |
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
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808-0043 | GainSpan Corporation | EVAL BOARD FOR GS2011MIE | Details |
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808-0044 | GainSpan Corporation | EVAL BOARD FOR GS2100MIE | Details |
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808-0045 | GainSpan Corporation | EVAL BOARD FOR GS2011MIZ | Details |
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808-0050 | GainSpan Corporation | EVAL BOARD FOR GS2011MIES | Details |
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808-0051 | GainSpan Corporation | EVAL BOARD FOR GS2100MIP | Details |
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808-0052 | GainSpan Corporation | ADAPTER BOARD WI-FI PMOD | Details |
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808-0055 | GainSpan Corporation | EVAL BOARD FOR GS2011MIPS | Details |
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808-0059 | GainSpan Corporation | RF EVAL DEV KITS IEEE 802.11 | Details |
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808-0061 | GainSpan Corporation | RF EVAL DEV KIT GS2101MIP | Details |
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808-0063 | GainSpan Corporation | EVAL BOARD FOR GS2101M | Details |
