BU060Z-178-HT Detailed Description
| Part Number |
BU060Z-178-HT |
| Part Status |
Active |
| Type |
DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) |
6 (2 x 3) |
| Pitch - Mating |
0.100" (2.54mm) |
| Contact Finish - Mating |
Gold |
| Contact Finish Thickness - Mating |
78.7µin (2.00µm) |
| Contact Material - Mating |
Beryllium Copper |
| Mounting Type |
Surface Mount |
| Features |
Open Frame |
| Termination |
Solder |
| Pitch - Post |
0.100" (2.54mm) |
| Contact Finish - Post |
Copper |
| Contact Finish Thickness - Post |
Flash |
| Contact Material - Post |
Brass |
| Housing Material |
Polybutylene Terephthalate (PBT), Glass Filled |
| Operating Temperature |
-55°C ~ 125°C |
| Weight |
- |
| Country of Origin |
- |
RELATED PRODUCTS FOR BU060Z-178-HT
