DIP318-011BLF

DIP318-011BLF - Amphenol FCI

Part Number
DIP318-011BLF
Manufacturer
Amphenol FCI
Brief Description
CONN IC DIP SOCKET 18POS GOLD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Datasheet online view
DIP318-011BLF PDF online browsing
Datasheet PDF Download
DIP318-011BLF.pdf
Category
Sockets for ICs, Transistors
Delivery Time
1 Day
Date Code
New
Stock Quantity
4046 pcs
Reference Price
USD 0/pcs
Our Price
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DIP318-011BLF Detailed Description

Part Number DIP318-011BLF
Part Status Obsolete
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 18 (2 x 9)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 10µin (0.25µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 200µin (5.08µm)
Contact Material - Post Brass
Housing Material Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Operating Temperature -
Weight -
Country of Origin -

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