| 画像 |
品番 |
メーカー | 説明 |
見る |
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APA501-80-006 |
Artesyn Embedded Technologies | HEATSINK (80) 115X59X37MM HORZ |
詳細 |
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APA501-60-001 |
Artesyn Embedded Technologies | HEATSINK (60) 57.5X59X15MM VERT |
詳細 |
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APA501-80-002 |
Artesyn Embedded Technologies | HEATSINK (80) 115X59X15MM HORZ |
詳細 |
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APA501-60-004 |
Artesyn Embedded Technologies | HEATSINK (60)57.5X59X22.5MM HORZ |
詳細 |
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APA501-60-005 |
Artesyn Embedded Technologies | HEATSINK (60) 57.5X59X37MM VERT |
詳細 |
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APA501-60-003 |
Artesyn Embedded Technologies | HEATSINK (60)57.5X59X22.5MM VERT |
詳細 |
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APA502-60-001 |
Artesyn Embedded Technologies | PAD THERMAL SIZE60 FOR AMPSS MOD |
詳細 |
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LGA-HTSK-KIT-045 |
Artesyn Embedded Technologies | LGA ACC KIT |
詳細 |
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APA501-60-006 |
Artesyn Embedded Technologies | HEATSINK (60) 57.5X59X37MM HORZ |
詳細 |
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APA501-60-007 |
Artesyn Embedded Technologies | HEATSINK (60)57.2X89X12MM LO PRO |
詳細 |
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APA501-80-005 |
Artesyn Embedded Technologies | HEATSINK (80) 115X59X37MM VERT |
詳細 |
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APA501-80-004 |
Artesyn Embedded Technologies | HEATSINK (80) 115X59X22.5MM HORZ |
詳細 |
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APA503-00-008 |
Artesyn Embedded Technologies | STUD MTG SOLDER FOR HEATSINK LP |
詳細 |
|
APA504-00-001 |
Artesyn Embedded Technologies | SOCKET SPRING(20-CONTROL/15-PWR) |
詳細 |
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LGA-HTSK-KIT-048 |
Artesyn Embedded Technologies | LGA ACC KIT |
詳細 |
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3780000200 |
Artesyn Embedded Technologies | PAD THERMAL 1/2 BRICK |
詳細 |
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03780200600 |
Artesyn Embedded Technologies | PAD THERMAL 1/4 BRICK |
詳細 |
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APA503-00-002 |
Artesyn Embedded Technologies | STUD MTG SOLDER FOR HEATSINK |
詳細 |
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LGA-HTSK-KIT-050 |
Artesyn Embedded Technologies | LGA ACC KIT |
詳細 |
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APA503-00-007 |
Artesyn Embedded Technologies | STUD MTG TAPPED FOR HEATSINK LP |
詳細 |
