| Immagine | Numero di parte | Produttori | Descrizione | vista |
|---|---|---|---|---|
 |
APA501-80-006 | Artesyn Embedded Technologies | HEATSINK (80) 115X59X37MM HORZ | Dettagli |
 |
APA501-60-001 | Artesyn Embedded Technologies | HEATSINK (60) 57.5X59X15MM VERT | Dettagli |
|
APA501-80-002 | Artesyn Embedded Technologies | HEATSINK (80) 115X59X15MM HORZ | Dettagli |
|
APA501-60-004 | Artesyn Embedded Technologies | HEATSINK (60)57.5X59X22.5MM HORZ | Dettagli |
|
APA501-60-005 | Artesyn Embedded Technologies | HEATSINK (60) 57.5X59X37MM VERT | Dettagli |
 |
APA501-60-003 | Artesyn Embedded Technologies | HEATSINK (60)57.5X59X22.5MM VERT | Dettagli |
|
APA502-60-001 | Artesyn Embedded Technologies | PAD THERMAL SIZE60 FOR AMPSS MOD | Dettagli |
|
LGA-HTSK-KIT-045 | Artesyn Embedded Technologies | LGA ACC KIT | Dettagli |
|
APA501-60-006 | Artesyn Embedded Technologies | HEATSINK (60) 57.5X59X37MM HORZ | Dettagli |
|
APA501-60-007 | Artesyn Embedded Technologies | HEATSINK (60)57.2X89X12MM LO PRO | Dettagli |
 |
APA501-80-005 | Artesyn Embedded Technologies | HEATSINK (80) 115X59X37MM VERT | Dettagli |
|
APA501-80-004 | Artesyn Embedded Technologies | HEATSINK (80) 115X59X22.5MM HORZ | Dettagli |
|
APA503-00-008 | Artesyn Embedded Technologies | STUD MTG SOLDER FOR HEATSINK LP | Dettagli |
|
APA504-00-001 | Artesyn Embedded Technologies | SOCKET SPRING(20-CONTROL/15-PWR) | Dettagli |
|
LGA-HTSK-KIT-048 | Artesyn Embedded Technologies | LGA ACC KIT | Dettagli |
|
3780000200 | Artesyn Embedded Technologies | PAD THERMAL 1/2 BRICK | Dettagli |
|
03780200600 | Artesyn Embedded Technologies | PAD THERMAL 1/4 BRICK | Dettagli |
|
APA503-00-002 | Artesyn Embedded Technologies | STUD MTG SOLDER FOR HEATSINK | Dettagli |
|
LGA-HTSK-KIT-050 | Artesyn Embedded Technologies | LGA ACC KIT | Dettagli |
|
APA503-00-007 | Artesyn Embedded Technologies | STUD MTG TAPPED FOR HEATSINK LP | Dettagli |
