| Número de pieza | 8080-1G15 |
|---|---|
| Estado de la pieza | Active |
| Tipo | Transistor, TO-3 |
| Número de posiciones o pines (cuadrícula) | 3 (Oval) |
| Paso - Apareamiento | - |
| Final de contacto - apareamiento | Tin-Lead |
| Contacto Espesor de acabado - Apareamiento | 200µin (5.08µm) |
| Material de contacto: apareamiento | Beryllium Copper |
| Tipo de montaje | Chassis Mount |
| Caracteristicas | Closed Frame |
| Terminación | Solder |
| Pitch - Publicar | - |
| Final de contacto - Publicación | Tin-Lead |
| Contacto Grosor del acabado - Publicación | 200µin (5.08µm) |
| Material de contacto: publicación | Beryllium Copper |
| Material de la carcasa | Fluoropolymer (FP) |
| Temperatura de funcionamiento | -55°C ~ 125°C |
| Peso | - |
| País de origen | - |
| Imagen | Número de pieza | Fabricantes | Descripción | Ver |
|---|---|---|---|---|
 |
808 | Keystone Electronics | TERMINAL STRIP STD 2 POS | Detalles |
 |
808-0043 | GainSpan Corporation | EVAL BOARD FOR GS2011MIE | Detalles |
 |
808-0044 | GainSpan Corporation | EVAL BOARD FOR GS2100MIE | Detalles |
 |
808-0045 | GainSpan Corporation | EVAL BOARD FOR GS2011MIZ | Detalles |
 |
808-0050 | GainSpan Corporation | EVAL BOARD FOR GS2011MIES | Detalles |
 |
808-0051 | GainSpan Corporation | EVAL BOARD FOR GS2100MIP | Detalles |
 |
808-0052 | GainSpan Corporation | ADAPTER BOARD WI-FI PMOD | Detalles |
 |
808-0055 | GainSpan Corporation | EVAL BOARD FOR GS2011MIPS | Detalles |
 |
808-0059 | GainSpan Corporation | RF EVAL DEV KITS IEEE 802.11 | Detalles |
 |
808-0061 | GainSpan Corporation | RF EVAL DEV KIT GS2101MIP | Detalles |
