| Part Number | 8080-1G15 |
|---|---|
| Part Status | Active |
| Type | Transistor, TO-3 |
| Number of Positions or Pins (Grid) | 3 (Oval) |
| Pitch - Mating | - |
| Contact Finish - Mating | Tin-Lead |
| Contact Finish Thickness - Mating | 200µin (5.08µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Chassis Mount |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | - |
| Contact Finish - Post | Tin-Lead |
| Contact Finish Thickness - Post | 200µin (5.08µm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Fluoropolymer (FP) |
| Operating Temperature | -55°C ~ 125°C |
| Weight | - |
| Country of Origin | - |
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|---|---|---|---|---|
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808-0045 | GainSpan Corporation | EVAL BOARD FOR GS2011MIZ | Details |
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808-0052 | GainSpan Corporation | ADAPTER BOARD WI-FI PMOD | Details |
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808-0055 | GainSpan Corporation | EVAL BOARD FOR GS2011MIPS | Details |
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808-0059 | GainSpan Corporation | RF EVAL DEV KITS IEEE 802.11 | Details |
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808-0061 | GainSpan Corporation | RF EVAL DEV KIT GS2101MIP | Details |
