| Número de pieza | 28-3551-18 |
|---|---|
| Estado de la pieza | Active |
| Tipo | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Número de posiciones o pines (cuadrícula) | 28 (2 x 14) |
| Paso - Apareamiento | 0.100" (2.54mm) |
| Final de contacto - apareamiento | Nickel Boron |
| Contacto Espesor de acabado - Apareamiento | 50µin (1.27µm) |
| Material de contacto: apareamiento | Beryllium Nickel |
| Tipo de montaje | Through Hole |
| Caracteristicas | Closed Frame |
| Terminación | Solder |
| Pitch - Publicar | 0.100" (2.54mm) |
| Final de contacto - Publicación | Nickel Boron |
| Contacto Grosor del acabado - Publicación | 50µin (1.27µm) |
| Material de contacto: publicación | Beryllium Nickel |
| Material de la carcasa | Polyetheretherketone (PEEK), Glass Filled |
| Temperatura de funcionamiento | -55°C ~ 250°C |
| Peso | - |
| País de origen | - |
| Imagen | Número de pieza | Fabricantes | Descripción | Ver |
|---|---|---|---|---|
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28-350002-10 | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.3 | Detalles |
|
28-350002-10-P | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.3 | Detalles |
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28-350002-11-RC | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.3 | Detalles |
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28-350002-11-RC-P | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.3 | Detalles |
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28-3503-20 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
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28-3503-21 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
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28-3503-30 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
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28-3503-31 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
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28-3508-20 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
|
28-3508-201 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
