| Número de pieza | 20-4518-10M |
|---|---|
| Estado de la pieza | Active |
| Tipo | DIP, 0.4" (10.16mm) Row Spacing |
| Número de posiciones o pines (cuadrícula) | 20 (2 x 10) |
| Paso - Apareamiento | 0.100" (2.54mm) |
| Final de contacto - apareamiento | Gold |
| Contacto Espesor de acabado - Apareamiento | 10µin (0.25µm) |
| Material de contacto: apareamiento | Beryllium Copper |
| Tipo de montaje | Through Hole |
| Caracteristicas | Open Frame |
| Terminación | Solder |
| Pitch - Publicar | 0.100" (2.54mm) |
| Final de contacto - Publicación | Tin |
| Contacto Grosor del acabado - Publicación | 200µin (5.08µm) |
| Material de contacto: publicación | Brass |
| Material de la carcasa | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Temperatura de funcionamiento | - |
| Peso | - |
| País de origen | - |
| Imagen | Número de pieza | Fabricantes | Descripción | Ver |
|---|---|---|---|---|
|
20-4508-20 | Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Detalles |
|
20-4508-21 | Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Detalles |
|
20-4508-30 | Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Detalles |
|
20-4508-31 | Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Detalles |
|
20-4518-00 | Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Detalles |
|
20-4518-01 | Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Detalles |
|
20-4518-10 | Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Detalles |
|
20-4518-10E | Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Detalles |
|
20-4518-10H | Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Detalles |
|
20-4518-10M | Aries Electronics | CONN IC DIP SOCKET 20POS GOLD | Detalles |
