808-AG11D-ES - TE Connectivity AMP Connectors

Part Number	808-AG11D-ES
Part Status	Active
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	8 (2 x 4)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	25.0µin (0.63µm)
Contact Material - Mating	Copper Alloy
Mounting Type	Through Hole
Features	Open Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	-
Contact Finish Thickness - Post	-
Contact Material - Post	-
Housing Material	Polyester
Operating Temperature	-55°C ~ 105°C
Weight	-
Country of Origin	-

Part Number	Manufacturers	Description	View
808-0043	GainSpan Corporation	EVAL BOARD FOR GS2011MIE	Details
808-0044	GainSpan Corporation	EVAL BOARD FOR GS2100MIE	Details
808-0045	GainSpan Corporation	EVAL BOARD FOR GS2011MIZ	Details
808-0050	GainSpan Corporation	EVAL BOARD FOR GS2011MIES	Details
808-0051	GainSpan Corporation	EVAL BOARD FOR GS2100MIP	Details
808-0052	GainSpan Corporation	ADAPTER BOARD WI-FI PMOD	Details
808-0055	GainSpan Corporation	EVAL BOARD FOR GS2011MIPS	Details
808-0059	GainSpan Corporation	RF EVAL DEV KITS IEEE 802.11	Details
808-0061	GainSpan Corporation	RF EVAL DEV KIT GS2101MIP	Details
808-0063	GainSpan Corporation	EVAL BOARD FOR GS2101M	Details