| Part Number | 24-6574-18 |
|---|---|
| Part Status | Active |
| Type | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Tin |
| Contact Finish Thickness - Mating | 200µin (5.08µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 200µin (5.08µm) |
| Contact Material - Post | Beryllium Copper |
| Housing Material | Polyphenylene Sulfide (PPS), Glass Filled |
| Operating Temperature | - |
| Weight | - |
| Country of Origin | - |
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
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24-650000-10 | Aries Electronics | SOCKET ADAPTER SOIC TO 24DIP 0.6 | Details |
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24-650000-10-P | Aries Electronics | SOCKET ADAPTER SOIC TO 24DIP 0.6 | Details |
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24-650000-11-RC | Aries Electronics | SOCKET ADAPTER SOIC TO 24DIP 0.6 | Details |
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24-650000-11-RC-P | Aries Electronics | SOCKET ADAPTER SOIC TO 24DIP 0.6 | Details |
