290-1294-00-3302J Detailed Description
| Part Number |
290-1294-00-3302J |
| Part Status |
Active |
| Type |
DIP, ZIF (ZIP) |
| Number of Positions or Pins (Grid) |
90 (2 x 45) |
| Pitch - Mating |
0.070" (1.78mm) |
| Contact Finish - Mating |
Gold |
| Contact Finish Thickness - Mating |
30µin (0.76µm) |
| Contact Material - Mating |
Beryllium Copper |
| Mounting Type |
Through Hole |
| Features |
Closed Frame |
| Termination |
Solder |
| Pitch - Post |
0.070" (1.78mm) |
| Contact Finish - Post |
Gold |
| Contact Finish Thickness - Post |
30µin (0.76µm) |
| Contact Material - Post |
Beryllium Copper |
| Housing Material |
Polysulfone (PSU), Glass Filled |
| Operating Temperature |
-55°C ~ 125°C |
| Weight |
- |
| Country of Origin |
- |
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