BU200Z-178-HT

BU200Z-178-HT - On Shore Technology Inc.

Part Number
BU200Z-178-HT
Manufacturer
On Shore Technology Inc.
Brief Description
CONN IC DIP SOCKET 20POS GOLD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Datasheet online view
BU200Z-178-HT PDF online browsing
Datasheet PDF Download
BU200Z-178-HT.pdf
Category
Sockets for ICs, Transistors
Delivery Time
1 Day
Date Code
New
Stock Quantity
930 pcs
Reference Price
USD 3.21/pcs
Our Price
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BU200Z-178-HT Detailed Description

Part Number BU200Z-178-HT
Part Status Active
Type DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid) 20 (2 x 10)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 78.7µin (2.00µm)
Contact Material - Mating Beryllium Copper
Mounting Type Surface Mount
Features Open Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Copper
Contact Finish Thickness - Post Flash
Contact Material - Post Brass
Housing Material Polybutylene Terephthalate (PBT), Glass Filled
Operating Temperature -55°C ~ 125°C
Weight -
Country of Origin -

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