85-PGM11007-10H Detailed Description
| Part Number |
85-PGM11007-10H |
| Part Status |
Active |
| Type |
PGA |
| Number of Positions or Pins (Grid) |
- |
| Pitch - Mating |
0.100" (2.54mm) |
| Contact Finish - Mating |
Gold |
| Contact Finish Thickness - Mating |
10µin (0.25µm) |
| Contact Material - Mating |
Beryllium Copper |
| Mounting Type |
Through Hole |
| Features |
- |
| Termination |
Solder |
| Pitch - Post |
0.100" (2.54mm) |
| Contact Finish - Post |
Tin |
| Contact Finish Thickness - Post |
200µin (5.08µm) |
| Contact Material - Post |
Brass |
| Housing Material |
Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature |
-55°C ~ 105°C |
| Weight |
- |
| Country of Origin |
- |
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