32-3513-11H - Aries Electronics

Part Number	32-3513-11H
Part Status	Active
Type	DIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	32 (2 x 16)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Gold
Contact Finish Thickness - Mating	10µin (0.25µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Gold
Contact Finish Thickness - Post	10µin (0.25µm)
Contact Material - Post	Brass
Housing Material	Polyamide (PA46), Nylon 4/6, Glass Filled
Operating Temperature	-
Weight	-
Country of Origin	-

Part Number	Manufacturers	Description	View
32-3030-0-01	Tallysman Wireless Inc.	RF ANT 1.575GHZ DOME TNC FEMALE	Details
32-3503-20	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Details
32-3503-21	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Details
32-3503-30	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Details
32-3503-31	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Details
32-3513-10	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Details
32-3513-10H	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Details
32-3513-10T	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Details
32-3513-11	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Details
32-3513-11H	Aries Electronics	CONN IC DIP SOCKET 32POS GOLD	Details