163-PLS15064-12 Detailed Description
| Part Number |
163-PLS15064-12 |
| Part Status |
Active |
| Type |
PGA, ZIF (ZIP) |
| Number of Positions or Pins (Grid) |
- |
| Pitch - Mating |
0.100" (2.54mm) |
| Contact Finish - Mating |
Gold |
| Contact Finish Thickness - Mating |
30µin (0.76µm) |
| Contact Material - Mating |
Beryllium Copper |
| Mounting Type |
Through Hole |
| Features |
Closed Frame |
| Termination |
Solder |
| Pitch - Post |
0.100" (2.54mm) |
| Contact Finish - Post |
Tin |
| Contact Finish Thickness - Post |
200µin (5.08µm) |
| Contact Material - Post |
Beryllium Copper |
| Housing Material |
Polyphenylene Sulfide (PPS) |
| Operating Temperature |
-65°C ~ 125°C |
| Weight |
- |
| Country of Origin |
- |
RELATED PRODUCTS FOR 163-PLS15064-12
