| Part Number | 12-822-90C |
|---|---|
| Part Status | Active |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 12 (2 x 6) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30µin (0.76µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole, Right Angle, Horizontal |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 200µin (5.08µm) |
| Contact Material - Post | Brass |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature | -55°C ~ 105°C |
| Weight | - |
| Country of Origin | - |
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|---|---|---|---|---|
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12-820-90C | Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | Details |
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12-822-90C | Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | Details |
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12-823-90C | Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | Details |
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12-8260-610C | Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | Details |
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12-8300-610C | Aries Electronics | CONN IC DIP SOCKET 12POS GOLD | Details |
