DIP324-001BLF Detailed Description
| Part Number |
DIP324-001BLF |
| Part Status |
Obsolete |
| Type |
DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) |
24 (2 x 12) |
| Pitch - Mating |
0.100" (2.54mm) |
| Contact Finish - Mating |
Gold |
| Contact Finish Thickness - Mating |
30µin (0.76µm) |
| Contact Material - Mating |
Beryllium Copper |
| Mounting Type |
Through Hole |
| Features |
Open Frame |
| Termination |
Solder |
| Pitch - Post |
0.100" (2.54mm) |
| Contact Finish - Post |
Tin |
| Contact Finish Thickness - Post |
200µin (5.08µm) |
| Contact Material - Post |
Brass |
| Housing Material |
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
| Operating Temperature |
- |
| Weight |
- |
| Country of Origin |
- |
RELATED PRODUCTS FOR DIP324-001BLF
