2100-7243-00-1807 Detailed Description
| Part Number |
2100-7243-00-1807 |
| Part Status |
Obsolete |
| Type |
QFP |
| Number of Positions or Pins (Grid) |
100 (4 x 25) |
| Pitch - Mating |
- |
| Contact Finish - Mating |
Tin-Lead |
| Contact Finish Thickness - Mating |
200µin (5.08µm) |
| Contact Material - Mating |
Beryllium Copper |
| Mounting Type |
Through Hole |
| Features |
Open Frame |
| Termination |
Solder |
| Pitch - Post |
- |
| Contact Finish - Post |
Tin-Lead |
| Contact Finish Thickness - Post |
200µin (5.08µm) |
| Contact Material - Post |
Beryllium Copper |
| Housing Material |
Polyethersulfone (PES), Glass Filled |
| Operating Temperature |
0°C ~ 105°C |
| Weight |
- |
| Country of Origin |
- |
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