.jpg "MC22FD501J-TF photos")
| Numero di parte | MC22FD501J-TF |
|---|---|
| Stato parte | Active |
| Capacità | 500pF |
| Tolleranza | ±5% |
| Tensione - Rated | 500V |
| Materiale dielettrico | Mica |
| temperatura di esercizio | -55°C ~ 125°C |
| Tipo di montaggio | Surface Mount |
| Pacchetto / caso | 2220 (5750 Metric) |
| Lead Spacing | - |
| Caratteristiche | RF, High Q, Low Loss |
| Dimensione / Dimensione | 0.224" L x 0.197" W (5.70mm x 5.00mm) |
| Altezza - Seduto (max) | 0.079" (2.00mm) |
| Peso | - |
| Paese d'origine | - |
| Immagine | Numero di parte | Produttori | Descrizione | vista |
|---|---|---|---|---|
|
MC22FA(1260)F-F | Cornell Dubilier Electronics (CDE) | CAP MICA 1260PF 1% 1KV 2220 | Dettagli |
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MC22FA010B | EXSHINE | High-Frequency, High-Stability Chip for Instruments and RF | Dettagli |
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MC22FA010B-T | EXSHINE | High-Frequency, High-Stability Chip for Instruments and RF | Dettagli |
|
MC22FA010C | EXSHINE | High-Frequency, High-Stability Chip for Instruments and RF | Dettagli |
|
MC22FA010C-T | EXSHINE | High-Frequency, High-Stability Chip for Instruments and RF | Dettagli |
|
MC22FA010D | EXSHINE | High-Frequency, High-Stability Chip for Instruments and RF | Dettagli |
|
MC22FA010D-T | EXSHINE | High-Frequency, High-Stability Chip for Instruments and RF | Dettagli |
|
MC22FA010F | EXSHINE | High-Frequency, High-Stability Chip for Instruments and RF | Dettagli |
|
MC22FA010F-T | EXSHINE | High-Frequency, High-Stability Chip for Instruments and RF | Dettagli |
|
MC22FA010G | EXSHINE | High-Frequency, High-Stability Chip for Instruments and RF | Dettagli |
