Immagine Numero di parte Produttori Descrizione vista
PAC5253QA PAC5253QA Active-Semi International Inc. 8X8 QFN, 48 PINS, 0.5 MM PITCH Dettagli
PAC5210QS PAC5210QS Active-Semi International Inc. IC PMU CONV/LDO REG Dettagli
PAC5220QS PAC5220QS Active-Semi International Inc. IC PMU CONV/LDO REG Dettagli
PAC5220QS-WP01 PAC5220QS-WP01 Active-Semi International Inc. IC PMU CONV/LDO REG Dettagli
PAC5250QF PAC5250QF Active-Semi International Inc. IC PMU CONV/LDO REG Dettagli
WDS3-UFE4-12-DC WDS3-UFE4-12-DC Microsemi Corporation UFE4 BOARD Dettagli
PM5990B-FEI PM5990B-FEI Microchip Technology DIGI G4 W/ ENCRYPTION. Dettagli
PM5991B-FEI PM5991B-FEI Microchip Technology DIGI-G4 OTN PROCESSOR WITHOUT E Dettagli
PM5980B-FEI PM5980B-FEI Microchip Technology DIGI-100GX OTN PROCESSOR WITH E Dettagli
PM5981B-FEI PM5981B-FEI Microchip Technology DIGI 100GX W/O ENCRYPTION Dettagli
PM5440B-FEI PM5440B-FEI Microchip Technology DIGI120GPBFREE Dettagli
PM5441A-FEI PM5441A-FEI Microchip Technology DIGI 60G PB FREE BUMPS Dettagli
MLX81115KLQ-AXX-000-RE MLX81115KLQ-AXX-000-RE Melexis Technologies NV IC DUAL LIN RGB 32K16K 6IO 12DFN Dettagli
MLX81120KLQ-AXX-000-RE MLX81120KLQ-AXX-000-RE Melexis Technologies NV IC LIN-TO-LIN GW CTRLR 12DFN Dettagli
MLX81112KDC-AXX-000-RE MLX81112KDC-AXX-000-RE Melexis Technologies NV IC LIN RGB 32KB 16KROM 4IO 8SOIC Dettagli
WIN867M6NHEI-300A1 WIN867M6NHEI-300A1 Microsemi Corporation WP2 86M67 300MHZLF BALLSPBFBUM Dettagli
WP32C2W3EFEI-320B2 WP32C2W3EFEI-320B2 Microsemi Corporation WP3 2C2W3 320MHZLF BALLSPBFBUM Dettagli
WIN860M6NHEI-300A1 WIN860M6NHEI-300A1 Microsemi Corporation WINPATH2 860M6 PROC 300MHZ LF Dettagli
WP32C2M6NFEI-400B2 WP32C2M6NFEI-400B2 Microsemi Corporation WINPATH3 2C2M6 PROC. 400MHZ B2 Dettagli
WP32C2M6NHEI-400B2 WP32C2M6NHEI-400B2 Microsemi Corporation WP3 2C2M6 400MHZLF BALLSPBFBUM Dettagli

Produttore raccomandato

Active-Semi International, Inc.