| Número de pieza | 50-9503-31 |
|---|---|
| Estado de la pieza | Active |
| Tipo | DIP, 0.9" (22.86mm) Row Spacing |
| Número de posiciones o pines (cuadrícula) | 50 (2 x 25) |
| Paso - Apareamiento | 0.100" (2.54mm) |
| Final de contacto - apareamiento | Gold |
| Contacto Espesor de acabado - Apareamiento | 10µin (0.25µm) |
| Material de contacto: apareamiento | Beryllium Copper |
| Tipo de montaje | Through Hole |
| Caracteristicas | Closed Frame |
| Terminación | Wire Wrap |
| Pitch - Publicar | 0.100" (2.54mm) |
| Final de contacto - Publicación | Gold |
| Contacto Grosor del acabado - Publicación | 10µin (0.25µm) |
| Material de contacto: publicación | Phosphor Bronze |
| Material de la carcasa | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Temperatura de funcionamiento | -55°C ~ 125°C |
| Peso | - |
| País de origen | - |
| Imagen | Número de pieza | Fabricantes | Descripción | Ver |
|---|---|---|---|---|
|
50-9503-20 | Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | Detalles |
|
50-9503-21 | Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | Detalles |
|
50-9503-30 | Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | Detalles |
|
50-9503-31 | Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | Detalles |
|
50-9508-20 | Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | Detalles |
|
50-9508-21 | Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | Detalles |
|
50-9508-30 | Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | Detalles |
|
50-9508-31 | Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | Detalles |
|
50-9513-10 | Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | Detalles |
|
50-9513-10H | Aries Electronics | CONN IC DIP SOCKET 50POS GOLD | Detalles |
