| Número de pieza | 40-6518-01 |
|---|---|
| Estado de la pieza | Active |
| Tipo | DIP, 0.6" (15.24mm) Row Spacing |
| Número de posiciones o pines (cuadrícula) | 40 (2 x 20) |
| Paso - Apareamiento | 0.100" (2.54mm) |
| Final de contacto - apareamiento | Gold |
| Contacto Espesor de acabado - Apareamiento | 10µin (0.25µm) |
| Material de contacto: apareamiento | Beryllium Copper |
| Tipo de montaje | Through Hole |
| Caracteristicas | Open Frame |
| Terminación | Solder |
| Pitch - Publicar | 0.100" (2.54mm) |
| Final de contacto - Publicación | Gold |
| Contacto Grosor del acabado - Publicación | 10µin (0.25µm) |
| Material de contacto: publicación | Brass |
| Material de la carcasa | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Temperatura de funcionamiento | - |
| Peso | - |
| País de origen | - |
| Imagen | Número de pieza | Fabricantes | Descripción | Ver |
|---|---|---|---|---|
 |
40-600-10 | Aries Electronics | DIP HEADER 40 PIN .600 | Detalles |
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40-650-10 | Aries Electronics | DIP HEADER COVER 40 PIN .270 | Detalles |
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40-6501-21 | Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | Detalles |
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40-6501-30 | Aries Electronics | CONN IC DIP SOCKET 40POS TIN | Detalles |
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40-6501-31 | Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | Detalles |
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40-6503-20 | Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | Detalles |
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40-6503-21 | Aries Electronics | CONN IC DIP SOCKET 40POS GOLD | Detalles |
