| Número de pieza | 28-C182-11H |
|---|---|
| Estado de la pieza | Active |
| Tipo | DIP, 0.6" (15.24mm) Row Spacing |
| Número de posiciones o pines (cuadrícula) | 28 (2 x 14) |
| Paso - Apareamiento | 0.100" (2.54mm) |
| Final de contacto - apareamiento | Gold |
| Contacto Espesor de acabado - Apareamiento | 10µin (0.25µm) |
| Material de contacto: apareamiento | Beryllium Copper |
| Tipo de montaje | Through Hole |
| Caracteristicas | Closed Frame |
| Terminación | Solder |
| Pitch - Publicar | 0.100" (2.54mm) |
| Final de contacto - Publicación | Gold |
| Contacto Grosor del acabado - Publicación | 10µin (0.25µm) |
| Material de contacto: publicación | Brass |
| Material de la carcasa | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Temperatura de funcionamiento | -55°C ~ 125°C |
| Peso | - |
| País de origen | - |
| Imagen | Número de pieza | Fabricantes | Descripción | Ver |
|---|---|---|---|---|
|
28-C182-00 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
 |
28-C182-10 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
|
28-C182-11H | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
|
28-C182-20 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
|
28-C182-21 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
|
28-C182-30 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
|
28-C182-31 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
|
28-C212-00 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
|
28-C212-10 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
|
28-C212-10T | Aries Electronics | CONN IC DIP SOCKET 28POS TIN | Detalles |
