| Número de pieza | 28-6575-18 |
|---|---|
| Estado de la pieza | Active |
| Tipo | DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing |
| Número de posiciones o pines (cuadrícula) | 28 (2 x 14) |
| Paso - Apareamiento | 0.100" (2.54mm) |
| Final de contacto - apareamiento | Tin |
| Contacto Espesor de acabado - Apareamiento | 200µin (5.08µm) |
| Material de contacto: apareamiento | Beryllium Copper |
| Tipo de montaje | Through Hole |
| Caracteristicas | Closed Frame |
| Terminación | Solder |
| Pitch - Publicar | 0.100" (2.54mm) |
| Final de contacto - Publicación | Tin |
| Contacto Grosor del acabado - Publicación | 200µin (5.08µm) |
| Material de contacto: publicación | Beryllium Copper |
| Material de la carcasa | Polyphenylene Sulfide (PPS), Glass Filled |
| Temperatura de funcionamiento | - |
| Peso | - |
| País de origen | - |
| Imagen | Número de pieza | Fabricantes | Descripción | Ver |
|---|---|---|---|---|
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28-600-10 | Aries Electronics | DIP HEADER 28 PIN .600 | Detalles |
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28-650000-10 | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.6 | Detalles |
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28-650000-10-P | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.6 | Detalles |
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28-650000-11-RC | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.6 | Detalles |
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28-650000-11-RC-P | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.6 | Detalles |
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28-6501-20 | Aries Electronics | CONN IC DIP SOCKET 28POS TIN | Detalles |
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28-6501-21 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Detalles |
