| Número de pieza | 16-8500-610C |
|---|---|
| Estado de la pieza | Active |
| Tipo | DIP, 0.6" (15.24mm) Row Spacing |
| Número de posiciones o pines (cuadrícula) | 16 (2 x 8) |
| Paso - Apareamiento | 0.100" (2.54mm) |
| Final de contacto - apareamiento | Gold |
| Contacto Espesor de acabado - Apareamiento | 30µin (0.76µm) |
| Material de contacto: apareamiento | Beryllium Copper |
| Tipo de montaje | Through Hole |
| Caracteristicas | Closed Frame, Elevated |
| Terminación | Solder |
| Pitch - Publicar | 0.100" (2.54mm) |
| Final de contacto - Publicación | Gold |
| Contacto Grosor del acabado - Publicación | 10µin (0.25µm) |
| Material de contacto: publicación | Brass |
| Material de la carcasa | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Temperatura de funcionamiento | -55°C ~ 105°C |
| Peso | - |
| País de origen | - |
| Imagen | Número de pieza | Fabricantes | Descripción | Ver |
|---|---|---|---|---|
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16-810-90 | Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Detalles |
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16-81250-310C | Aries Electronics | CONN IC DIP SOCKET 16POS GOLD | Detalles |
