| Part Number | 28-3554-18 |
|---|---|
| Part Status | Active |
| Type | DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Nickel Boron |
| Contact Finish Thickness - Mating | 50µin (1.27µm) |
| Contact Material - Mating | Beryllium Nickel |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Nickel Boron |
| Contact Finish Thickness - Post | 50µin (1.27µm) |
| Contact Material - Post | Beryllium Nickel |
| Housing Material | Polyetheretherketone (PEEK), Glass Filled |
| Operating Temperature | -55°C ~ 250°C |
| Weight | - |
| Country of Origin | - |
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
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28-350002-10 | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.3 | Details |
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28-350002-10-P | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.3 | Details |
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28-350002-11-RC | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.3 | Details |
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28-350002-11-RC-P | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.3 | Details |
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28-3503-20 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Details |
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28-3503-21 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Details |
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28-3503-30 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Details |
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28-3503-31 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Details |
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28-3508-20 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Details |
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28-3508-201 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Details |
