| Part Number | 21-0508-30 |
|---|---|
| Part Status | Active |
| Type | SIP |
| Number of Positions or Pins (Grid) | 21 (1 x 21) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10µin (0.25µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | - |
| Termination | Wire Wrap |
| Pitch - Post | - |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 200µin (5.08µm) |
| Contact Material - Post | Brass |
| Housing Material | Polyamide (PA46), Nylon 4/6 |
| Operating Temperature | -55°C ~ 105°C |
| Weight | - |
| Country of Origin | - |
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|---|---|---|---|---|
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21-0068PBF | Infineon Technologies | IC REG BUCK ADJ 35A SYNC LGA | Details |
