| Part Number | 18-81000-310C |
|---|---|
| Part Status | Active |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 18 (2 x 9) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30µin (0.76µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame, Elevated |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 10µin (0.25µm) |
| Contact Material - Post | Brass |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature | -55°C ~ 105°C |
| Weight | - |
| Country of Origin | - |
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
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18-81250-310C | Aries Electronics | CONN IC DIP SOCKET 18POS GOLD | Details |
