SIP1X02-001BLF Detailed Description
Part Number |
SIP1X02-001BLF |
Part Status |
Obsolete |
Type |
SIP |
Number of Positions or Pins (Grid) |
2 (1 x 2) |
Pitch - Mating |
0.100" (2.54mm) |
Contact Finish - Mating |
Gold |
Contact Finish Thickness - Mating |
30µin (0.76µm) |
Contact Material - Mating |
Beryllium Copper |
Mounting Type |
Through Hole |
Features |
Closed Frame |
Termination |
Solder |
Pitch - Post |
0.100" (2.54mm) |
Contact Finish - Post |
Tin |
Contact Finish Thickness - Post |
200µin (5.08µm) |
Contact Material - Post |
Brass |
Housing Material |
Polyphenylene Sulfide (PPS), Glass Filled |
Operating Temperature |
- |
Weight |
- |
Country of Origin |
- |
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