200-6325-9UN-1900 Detailed Description
| Part Number |
200-6325-9UN-1900 |
| Part Status |
Active |
| Type |
PGA, ZIF (ZIP) |
| Number of Positions or Pins (Grid) |
625 (25 x 25) |
| Pitch - Mating |
0.100" (2.54mm) |
| Contact Finish - Mating |
Gold |
| Contact Finish Thickness - Mating |
30µin (0.76µm) |
| Contact Material - Mating |
Beryllium Copper |
| Mounting Type |
Through Hole |
| Features |
- |
| Termination |
Solder |
| Pitch - Post |
0.100" (2.54mm) |
| Contact Finish - Post |
Gold |
| Contact Finish Thickness - Post |
30µin (0.76µm) |
| Contact Material - Post |
Beryllium Copper |
| Housing Material |
Polyethersulfone (PES) |
| Operating Temperature |
-55°C ~ 150°C |
| Weight |
- |
| Country of Origin |
- |
RELATED PRODUCTS FOR 200-6325-9UN-1900
