550-10-352M26-001166 Detailed Description
Part Number |
550-10-352M26-001166 |
Part Status |
Active |
Type |
BGA |
Number of Positions or Pins (Grid) |
352 (26 x 26) |
Pitch - Mating |
0.050" (1.27mm) |
Contact Finish - Mating |
Gold |
Contact Finish Thickness - Mating |
10µin (0.25µm) |
Contact Material - Mating |
Beryllium Copper |
Mounting Type |
Through Hole |
Features |
Closed Frame |
Termination |
Solder |
Pitch - Post |
0.050" (1.27mm) |
Contact Finish - Post |
Gold |
Contact Finish Thickness - Post |
10µin (0.25µm) |
Contact Material - Post |
Brass |
Housing Material |
FR4 Epoxy Glass |
Operating Temperature |
-55°C ~ 125°C |
Weight |
- |
Country of Origin |
- |
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