36-6553-18

36-6553-18 - Aries Electronics

Part Number
36-6553-18
Manufacturer
Aries Electronics
Brief Description
CONN IC DIP SOCKET ZIF 40POS TIN
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Datasheet online view
36-6553-18 PDF online browsing
Datasheet PDF Download
-
Category
Sockets for ICs, Transistors
Delivery Time
1 Day
Date Code
New
Stock Quantity
365 pcs
Reference Price
USD 74.1923/pcs
Our Price
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36-6553-18 Detailed Description

Part Number 36-6553-18
Part Status Active
Type DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid) 40 (2 x 20)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Tin
Contact Finish Thickness - Mating 200µin (5.08µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 200µin (5.08µm)
Contact Material - Post Beryllium Copper
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature -
Weight -
Country of Origin -

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