| Part Number | 28-6513-11H |
|---|---|
| Part Status | Active |
| Type | DIP, 0.6" (15.24mm) Row Spacing |
| Number of Positions or Pins (Grid) | 28 (2 x 14) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10µin (0.25µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Closed Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 10µin (0.25µm) |
| Contact Material - Post | Brass |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature | - |
| Weight | - |
| Country of Origin | - |
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
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28-650000-11-RC | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.6 | Details |
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28-650000-11-RC-P | Aries Electronics | SOCKET ADAPTER SOIC TO 28DIP 0.6 | Details |
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28-6501-20 | Aries Electronics | CONN IC DIP SOCKET 28POS TIN | Details |
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28-6501-21 | Aries Electronics | CONN IC DIP SOCKET 28POS GOLD | Details |
