28-3552-16 - Aries Electronics

Part Number	28-3552-16
Part Status	Active
Type	DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)	28 (2 x 14)
Pitch - Mating	0.100" (2.54mm)
Contact Finish - Mating	Nickel Boron
Contact Finish Thickness - Mating	50µin (1.27µm)
Contact Material - Mating	Beryllium Copper
Mounting Type	Through Hole
Features	Closed Frame
Termination	Solder
Pitch - Post	0.100" (2.54mm)
Contact Finish - Post	Nickel Boron
Contact Finish Thickness - Post	50µin (1.27µm)
Contact Material - Post	Beryllium Copper
Housing Material	Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature	-
Weight	-
Country of Origin	-

Part Number	Manufacturers	Description	View
28-350002-10	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.3	Details
28-350002-10-P	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.3	Details
28-350002-11-RC	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.3	Details
28-350002-11-RC-P	Aries Electronics	SOCKET ADAPTER SOIC TO 28DIP 0.3	Details
28-3503-20	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	Details
28-3503-21	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	Details
28-3503-30	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	Details
28-3503-31	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	Details
28-3508-20	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	Details
28-3508-201	Aries Electronics	CONN IC DIP SOCKET 28POS GOLD	Details