| Part Number | 24-3508-312 |
|---|---|
| Part Status | Active |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 24 (2 x 12) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 30µin (0.76µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Open Frame |
| Termination | Wire Wrap |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Gold |
| Contact Finish Thickness - Post | 10µin (0.25µm) |
| Contact Material - Post | Brass |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature | -55°C ~ 125°C |
| Weight | - |
| Country of Origin | - |
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
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24-3503-21 | Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | Details |
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24-3503-30 | Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | Details |
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24-3503-31 | Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | Details |
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24-3508-20 | Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | Details |
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24-3508-201 | Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | Details |
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24-3508-202 | Aries Electronics | CONN IC DIP SOCKET 24POS GOLD | Details |
