| Part Number | 21-0518-10H |
|---|---|
| Part Status | Active |
| Type | SIP |
| Number of Positions or Pins (Grid) | 21 (1 x 21) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10µin (0.25µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Open Frame |
| Termination | Solder |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 200µin (5.08µm) |
| Contact Material - Post | Brass |
| Housing Material | Polyamide (PA46), Nylon 4/6, Glass Filled |
| Operating Temperature | - |
| Weight | - |
| Country of Origin | - |
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|---|---|---|---|---|
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21-0042CS | IOR | 21-0042CS IOR BGA New Original Stocks | Details |
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21-0065PBF | Infineon Technologies | IC REG BUCK ADJ 25A SYNC LGA | Details |
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21-0067 | Infineon Technologies | IC REG BUCK ADJ 40A SYNC LGA | Details |
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21-0068PBF | Infineon Technologies | IC REG BUCK ADJ 35A SYNC LGA | Details |
