SIP1X27-001BLF

SIP1X27-001BLF - Amphenol FCI

Part Number
SIP1X27-001BLF
Manufacturer
Amphenol FCI
Brief Description
CONN SOCKET SIP 27POS GOLD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Datasheet online view
SIP1X27-001BLF PDF online browsing
Datasheet PDF Download
SIP1X27-001BLF.pdf
Category
Sockets for ICs, Transistors
Delivery Time
1 Day
Date Code
New
Stock Quantity
3555 pcs
Reference Price
USD 0/pcs
Our Price
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SIP1X27-001BLF Detailed Description

Part Number SIP1X27-001BLF
Part Status Obsolete
Type SIP
Number of Positions or Pins (Grid) 27 (1 x 27)
Pitch - Mating 0.100" (2.54mm)
Contact Finish - Mating Gold
Contact Finish Thickness - Mating 30µin (0.76µm)
Contact Material - Mating Beryllium Copper
Mounting Type Through Hole
Features Closed Frame
Termination Solder
Pitch - Post 0.100" (2.54mm)
Contact Finish - Post Tin
Contact Finish Thickness - Post 200µin (5.08µm)
Contact Material - Post Brass
Housing Material Polyphenylene Sulfide (PPS), Glass Filled
Operating Temperature -
Weight -
Country of Origin -

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