| Part Number | D2608-42 |
|---|---|
| Part Status | Active |
| Type | DIP, 0.3" (7.62mm) Row Spacing |
| Number of Positions or Pins (Grid) | 8 (2 x 4) |
| Pitch - Mating | 0.100" (2.54mm) |
| Contact Finish - Mating | Gold |
| Contact Finish Thickness - Mating | 10µin (0.25µm) |
| Contact Material - Mating | Beryllium Copper |
| Mounting Type | Through Hole |
| Features | Open Frame |
| Termination | Press-Fit |
| Pitch - Post | 0.100" (2.54mm) |
| Contact Finish - Post | Tin |
| Contact Finish Thickness - Post | 196.8µin (5.00µm) |
| Contact Material - Post | Brass |
| Housing Material | Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled |
| Operating Temperature | -55°C ~ 125°C |
| Weight | - |
| Country of Origin | - |
| Image | Part Number | Manufacturers | Description | View |
|---|---|---|---|---|
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D2601N85TXPSA1 | Infineon Technologies | DIODE GEN PURP 8.5KV 3040A | Details |
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D2601N90TXPSA1 | Infineon Technologies | DIODE GEN PURP 9KV 3040A | Details |
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D2601NH90TXPSA1 | Infineon Technologies | DIODE GEN PURP 9KV 1790A | Details |
|
D2608-42 | Harwin Inc. | CONN IC DIP SOCKET 8POS GOLD | Details |
|
D2614-42 | Harwin Inc. | CONN IC DIP SOCKET 14POS GOLD | Details |
|
D2616-42 | Harwin Inc. | CONN IC DIP SOCKET 16POS GOLD | Details |
|
D2618-42 | Harwin Inc. | IC SOCKET ASSEMBLY 18POS | Details |
|
D2620-42 | Harwin Inc. | CONN IC DIP SOCKET 20POS GOLD | Details |
|
D2624-42 | Harwin Inc. | CONN IC DIP SOCKET 24POS GOLD | Details |
|
D2628-42 | Harwin Inc. | CONN IC DIP SOCKET 28POS GOLD | Details |
